Single Layer Diamond Vacuum Brazing

Compared with single-layer electroplated diamond tools, brazed single-layer diamond tools have become a hot research field of superhard material tools in recent years due to high diamond edge, large chip space, and high bonding strength between diamond and matrix.

Hard and brittle materials, such as ordinary building materials such as stone, glass, and ceramics, as well as high-grade advanced engineering and functional materials such as gemstones, semiconductors, engineering ceramics, optical crystals, magnetic materials, and bioceramics, need to be prepared with abrasives with higher hardness. As a tool, diamond has extremely high hardness, high relative wear resistance, thermal conductivity and compressive strength compared with other abrasives. Therefore, diamond tools are the most commonly used tools for cutting and grinding hard and brittle materials. In the manufacturing process of metal bond diamond tools, sintering and electroplating are the two most important manufacturing methods. Due to the low bonding strength between the diamond and the bond and the low cutting edge of the diamond, the working efficiency and service life of these two tools are low.

As a new method of manufacturing diamond tools, brazing has received extensive attention at home and abroad. During the brazing process, the solder alloy melts and capillary action makes the alloy tightly wrap the diamond, and at the same time, a strong chemical bond is formed between the diamond and the solder alloy, which greatly improves the bonding strength of the diamond and the cutting edge height of the diamond, thereby improving the tool’s performance. Cutting performance and self-sharpening, especially suitable for high-speed and high-efficiency grinding.

Process flow: The vacuum degree is generally about 2X10-2Pa. For some brazing materials, low vacuum (about 2Pa) can also make a good brazing diamond tool, but the diamond used should be above 16Kg. The temperature rises slowly from room temperature to 400°C, so that the flux is completely volatilized, and the temperature rises rapidly from 400°C to 680°C to improve work efficiency. The solder melts at about 680°C, and the temperature rises at a medium speed. Using slow heating to provide a uniform temperature field, the heat can be stopped and cooled for 5-15 minutes.

Equipment selection: The single-chamber vacuum brazing furnace has low production efficiency, which is unfavorable for high-vacuum brazing. The three-chamber vacuum brazing furnace is an ideal choice. There is a preheating chamber that can heat the workpiece to about 500 ℃, which can make the flux and other harmful The substance is basically volatilized, and after brazing is completed, it can enter the cooling chamber for rapid cooling, which is good for the substrate, with high production efficiency, good product quality, low production cost, and a large one-time investment in equipment.

The RHVB-H high temperature vacuum brazing furnace produced by SIMUWU is a high-quality product for this type of brazing process. Good temperature control accuracy and temperature control uniformity ensure the effective progress of the vacuum brazing process. With more than ten years of sales and manufacturing experience, it is exported to developed regions in Europe, America and Asia. It is a widely acclaimed vacuum furnace product.