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Heat Treatment Anti-carburizing Copper Plating Process
Some of the heat-treated products require partial carburization, while such products require anti-seepage treatment in the non-carburized area. At present, copper plating technology is widely used for protection. The gas carburizing heat treatment temperature is 900-930°C, and the time is several to ten hours. The copper plating requirements are also higher under the conditions of high temperature and long time heat treatment.
Requirements for copper plating process:
1. The copper-plated layer has good adhesion. If the bonding force is poor, pores will appear. During the carburizing heat treatment, the copper layer will bubble, peel, and peel off, so that the non-carburized layer will be carburized.
2. The copper layer is required to be dense and finely crystallized. If the crystal is coarse, the purpose of anti-seepage will not be achieved.
3. The copper layer must be removed after carburizing heat treatment. Considering the economics of copper plating and copper removal, the copper layer must be as uniform as possible when plating more complex parts to reduce the thickness of the copper layer, so the copper plating solution has a better dispersion ability.
At present, in most production processes, there are mainly the following types of anti-carburizing copper plating processes:
1. Cyanide copper plating process.
2. Cyanide pre-plating/common copper sulfate copper plating process.
3. Cyanide pre-plating/pyrophosphate copper plating process.
4. Copper immersion/pyrophosphate copper plating process.
5. Citrate copper plating process.
For large batches of partial carburizing and heat treatment products, the third method should be considered first; if the partial carburizing and heat treatment products are produced in small batches, the copper plating process of citrate is better.
The choice of the anti-carburizing copper plating process in the heat treatment process is directly related to the quality of the partial carburized parts. In the production, the quality of the anti-seepage copper plating layer is unreliable, which often results in the parts being scrapped. What is more serious is that if anti-seepage The faulty products flow into the next process and are assembled in large-scale mechanical products, which may cause serious casualties. Therefore, the anti-carburizing copper plating process must be selected reasonably during the heat treatment process.
Learn more:
Vacuum Carburizing Furnace
Gas Carburzing Furnace
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