Ceramic and copper brazing

Brazing (commonly known as sealing) of ceramics and metals is widely used in the manufacture of electronic tubes and semiconductors, as well as in the sealing of transformers, rectifiers, capacitors and mercury switches.

Ceramic and metal connection in the vacuum furnace or hydrogen, argon furnace.It is required that the solder for vacuum electronic devices should not contain elements that generate high vapor pressure, that is, volatile elements (such as Zr, Cd, Bi, Mg, Li, etc.), so as to avoid causing electrical leakage of devices and cathode poisoning.It is generally stipulated that the vapor pressure of the solder shall not exceed 10-3pa and the impurity containing high vapor pressure shall not exceed 0.002%~0.005% when the device is working.The filler metal contains no more than 0.001% oxygen content to avoid water vapor generated during brazing in hydrogen gas, causing spatter.In addition, the solder must not have oxides on the surface.

learn more : Vacuum Brazing Furnace