AMB brazing of copper clad ceramic substrate

---

Ceramic copper clad laminate (CCL) is an important component of high-voltage and high-power IGBT module. It has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, low expansion and so on. It also has the high conductivity and excellent welding performance of oxygen free copper, and can etch various patterns like PCB.

In particular, active metal bonding (AMB) ceramic copper clad laminate (CCL) has become the preferred packaging material for new generation semiconductor (SIC) and new high power electronic devices due to its unique high and low temperature impact resistance. High voltage and high-power IGBT modules have higher requirements on heat dissipation, reliability and current carrying capacity of packaging materials, and the domestic related technology level is backward, which leads to the monopoly of domestic related markets by European, American, Japanese and other countries.

We have made a breakthrough in the field of engineering manufacturing of active metal brazing (active solder) ceramic copper clad substrate, and successfully developed large area (4.5 “* 4.5”) aluminum nitride copper clad substrate in China. In the development process, the project team has successively broken through the high-precision solder coating technology, established the theory of reducing welding stress, realized the process of high-purity welding and precise control of welding layer structure, and finally successfully manufactured the low stress, high reliability, large area copper-clad substrate through repeated optimization.

Aluminum nitride, silicon nitride and other copper-clad substrates are directly brazed with AMB active solder, which requires a metallized brazing solution. You can contact us directly online!

A variety of new ceramic copper clad laminate (SiC, Si3N4, etc.) brazing solution of active solder.

Active brazing technology of nonmetal (ceramic alumina, SiC, AlN, Si3N4, sapphire, diamond, PCD, CBN, diamond, graphite, carbon, carbon silicon carbide composite, cemented carbide, etc.) and metal. Vacuum brazing process, brazing furnace.