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Vacuum brazing liquid cooling heat sink plate
Nowadays, liquid-cooled heat sinks have become the preferred cooling method for various high-end electronic technology products, ranging from our common mobile phones and laptops to highly professional large-scale servers, laser cutting equipment, engines, wind turbines, etc.
Whether it is a precision instrument or a high-power heavy machinery, if the heat dissipation is poor, the high temperature will not only reduce the working stability of the chip, but also generate excessive thermal stress due to the temperature difference between the inside of the module and the external environment, affecting the electrical performance and work of the chip. frequency, mechanical strength and reliability.
For example, the failure rate of electronic components increases exponentially as the operating temperature increases. For every 10 degrees increase in the temperature of a single semiconductor component, the reliability of the system will be reduced by 50%. It not only speeds up the service life of original parts, but also easily leads to the occurrence of various accidents.
Liquid cooling manufacturing process
Vacuum brazing involves filling solder between two motherboards and placing them in a vacuum brazing furnace for heating and welding. It is very suitable for welding heat sinks with dense water channels. However, vacuum brazing takes a long time, the solder is easily lost, and water leakage can easily occur. The yield is affected by process proficiency.
In vacuum brazing technology, tool steel must be cleaned before brazing. The surface of cemented carbide should be sandblasted or polished with silicon carbide or diamond grinding wheels before brazing to remove excess carbon on the surface so that it can be wetted by the brazing material during brazing. Cemented carbide containing titanium carbide is difficult to wet. By applying copper oxide or nickel oxide paste on the surface, and baking it in a reducing atmosphere, the copper or nickel transfers to the surface, thereby increasing the strength of the brazing process. The wettability of the material.
When applied to liquid cooling heat dissipation, the advantages of vacuum brazing in creating dense water channels, energy production, and high efficiency are infinitely amplified, and it has become the preferred welding technology for liquid cooling heat dissipation components in various industries.
Application cases of vacuum brazing
Aluminum vapor chamber (also known as “vapor chamber”) VC (Vapor Chamber) is a new type of heat pipe. The inner wall of the vacuum chamber has a fine structure, and heat is repeatedly circulated through the evaporation and condensation of the internal liquid.
1. Compared with traditional heat pipes, because it truly realizes direct heat transfer in a two-dimensional large plane, the heat conduction efficiency is higher.
2. Aluminum alloy materials and various insulating media can be used. Eliminates potential safety hazards when using electricity.
3. Light weight and long life.
Aluminum radiator
In the fields of 3C electronics, supercomputing and industrial control servers, aluminum radiators/water-cooling plates are the earliest and most popular.
The surface of the CPU, GPU, power supply and other heat-generating components are covered with a layer of liquid-cooling heat sinks, which remove heat through liquid thermal circulation. It is also directly connected to the heat sink fins and works in conjunction with powerful fans to quickly dissipate internal heat.
Copper aluminum composite radiator
The thermal energy efficiency and density of copper and aluminum materials are quite different. Copper-aluminum composite radiators can use copper materials to directly contact the heat source and then dissipate heat through aluminum fins.
Advantages: Efficient heat absorption/heat dissipation of the radiator can be achieved. The space is small and naturally air-cooled.
Learn More:
Gas carburization techniques
Research on vacuum annealing of titanium alloys
Advanced vacuum high pressure gas quenching technology