PRODUCT CATEGORIES

Vacuum Heat Treatment Furnace

Vacuum Sintering Furnace

Vacuum Brazing Furnace

Pressureless Sintering Process of Special Ceramics in Semiconductor Industry

Due to their superior electromechanical and physical properties, specialty ceramics are increasingly used in the semiconductor industry. With the development of integrated circuits in the direction of miniaturization, high speed and low cost, semiconductor equipment manufacturers rely more and more on special ceramic components to make their equipment meet the requirements of the IC industry. Most of the special ceramics used in the semiconductor industry still use the traditional preparation process. The biggest difference is that the special ceramics are required to have high purity, and sometimes the electrical properties of the special ceramics are also demanding. The main products are various sealing rings and rings, arched covers, various diffusion furnace linings, various pins, wafer substrates and susceptors, end effectors, vacuum chucks, etc.

In the semiconductor industry, in addition to fused silica, the most widely used special ceramics are various oxide ceramics. Oxide ceramics such as alumina and zirconia parts are usually directly processed from semi-finished products, which are prepared by cold isostatic pressing or dry pressing and fired by pressureless sintering. The key to component production is subsequent processing. As the size of silicon wafers increases, larger ceramic components are required, and the processing accuracy requirements are exactly the same as those of small ones.

Application of silicon carbide ceramics in semiconductor industry

The main component of silicon carbide ceramic material is SiC. It has excellent mechanical properties, excellent oxidation resistance, extremely high wear resistance and low friction coefficient. The biggest advantage of silicon carbide ceramics is that it can maintain high strength and hardness at a high temperature of 1400 degrees Celsius. In addition, the thermal conductivity of pressureless silicon carbide ceramics is also very high, second only to beryllium oxide and aluminum nitride ceramics, so it is suitable for various harsh environments.

Using the high thermal conductivity and good insulation of silicon carbide ceramics, it can be used as a substrate and packaging material for large-scale integrated circuits. Silicon carbide heating element is a commonly used heating element. Because of its advantages of simple and convenient operation, long service life and wide application range, it has become the most durable, cheap and high-quality heating material.

Silicon carbide has been used as a backing plate in the diffusion furnace for the production of single crystal silicon wafers for nearly 50 years. Since it has the same thermal expansion coefficient as monocrystalline silicon, high elastic modulus, high thermal conductivity and chemical inertness, it is also used as a large vacuum chuck and mechanical chemical polishing (CMP) pad mold. At the same time, due to its high purity and plasma erosion resistance, it is an ideal material for plasma etching chambers.

Silicon carbide parts with complex shapes and large sizes are all completed by slip casting and subsequent machining. High-purity silicon carbide powder and binder are made into a slurry, injected into a plaster mold to obtain a green body, and processed to the required size by a CNC grinder. It is sintered in a vacuum sintering furnace at a temperature above 2000°C, and the sintered product is finally finished into the desired part. Simple silicon carbide components are usually formed by dry pressing, cold isostatic pressing (CIP), or extrusion. After the powder is spray-dried, it is formed by isostatic pressing, and under the action of boron carbide as a sintering aid, it is sintered into a product without pressure. Silicon carbide ceramics have excellent performance and are widely used in the semiconductor electronics industry.

Process flow for the production of pressureless sintered silicon carbide ceramics:

Ingredients—ball milling—spray granulation—compression molding—biscuit processing—pressureless sintering—post-processing

Among them, pressureless sintering is a key link in the production of silicon carbide ceramics. The processing effect of this link will directly determine the quality of the finished product, so the selection of silicon carbide sintering furnace is very important.

The RVS-S series pressureless silicon carbide sintering furnace produced by SIMUWU can well meet the needs of silicon carbide pressureless sintering. It can be heated up to 2400 degrees Celsius and has good temperature uniformity and vacuum.

SIMUWU has more than ten years of sales and manufacturing experience in the field of vacuum furnaces, and can effectively meet the different process needs of customers. The mature engineer team can help manufacturers complete a series of needs from installation to after-sales. In the field of silicon carbide sintering, many factories have chosen this brand. Its technology is mature and reliable, and it is an outstanding brand in the field of pressureless silicon carbide sintering furnaces.